single crystal ingot pulling
the process of slowly rotating and pulling the dissolved polysilicon material to make a single crystal ingot.
ic
integrated circuits (ic) are supported by semiconductor devices and equipment. ferrotec adopts advanced technology and high-end manufacturing equipment to produce high-quality products and facilitate the rapid development of the ic industry.
oxidation • diffusion
film formation on the surface of silicon wafer.
photoresist coating
the photoresist is uniformly coated on the surface of the wafer and its properties change when exposed to ultraviolet light.
lithography
the photoresist layer is exposed to ultraviolet light through a mask to form an electro pattern.
corrosion
remove any unwanted photoresist with a plasma etcher.
pecvd
ions are injected into the acidified film to form a semiconductor with desired properties. and, to multilayer, make an insulating film.
grinding
the silicon wafer is ground into a mirror shape.
silicon ingots
slice monocrystalline silicon ingot horizontally with diamond wire saw.
grade test
identify key features of each processor, such as maximum power, power consumption, and heat generation.
encapsulation
the substrate, the core, and the heat sink are stacked together to form a processor. finally, remove from the fixed plate.
flattened
polish the wafer surface.
electroplating
electroplate a layer of copper sulfate to precipitate copper ions onto the transistor. after electroplating, a thin layer of copper is formed.
wafer test
each chip fabricated on the wafer is functionally tested with a defective portion.
wafer slicing
cut a wafer into pieces, each of which is a processor core.
welding wire
secure the processor with the fixed plate and weld the wire.
complete
print the product model.
single crystal ingot pulling
the process of slowly rotating and pulling the dissolved polysilicon material to make a single crystal ingot.
oxidation • diffusion
film formation on the surface of silicon wafer.
photoresist coating
the photoresist is uniformly coated on the surface of the wafer and its properties change when exposed to ultraviolet light.
lithography
the photoresist layer is exposed to ultraviolet light through a mask to form an electro pattern.
corrosion
remove any unwanted photoresist with a plasma etcher.
pecvd
ions are injected into the acidified film to form a semiconductor with desired properties. and, to multilayer, make an insulating film.
grinding
the silicon wafer is ground into a mirror shape.
silicon ingots
slice monocrystalline silicon ingot horizontally with diamond wire saw.
grade test
identify key features of each processor, such as maximum power, power consumption, and heat generation.
encapsulation
the substrate, the core, and the heat sink are stacked together to form a processor. finally, remove from the fixed plate.
flattened
polish the wafer surface.
electroplating
electroplate a layer of copper sulfate to precipitate copper ions onto the transistor. after electroplating, a thin layer of copper is formed.
wafer test
each chip fabricated on the wafer is functionally tested with a defective portion.
wafer slicing
cut a wafer into pieces, each of which is a processor core.
welding wire
secure the processor with the fixed plate and weld the wire.
complete
print the product model.
products used in this process
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1.single crystal ingot pullingthe process of slowly rotating and pulling the dissolved polysilicon material to make a single crystal ingot.products used in this process
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2.oxidation • diffusionfilm formation on the surface of silicon wafer.products used in this process
-
3.photoresist coatingthe photoresist is uniformly coated on the surface of the wafer and its properties change when exposed to ultraviolet light.products used in this process
-
4.lithographythe photoresist layer is exposed to ultraviolet light through a mask to form an electro pattern.products used in this process
-
5.corrosionremove any unwanted photoresist with a plasma etcher.products used in this process
-
6.pecvdions are injected into the acidified film to form a semiconductor with desired properties. and, to multilayer, make an insulating film.products used in this process
-
7.grindingthe silicon wafer is ground into a mirror shape.products used in this process
-
8.silicon ingotsslice monocrystalline silicon ingot horizontally with diamond wire saw.products used in this process
-
9.grade testidentify key features of each processor, such as maximum power, power consumption, and heat generation.products used in this process
-
10.encapsulationthe substrate, the core, and the heat sink are stacked together to form a processor. finally, remove from the fixed plate.products used in this process
-
11.flattenedpolish the wafer surface.products used in this process
-
12.electroplatingelectroplate a layer of copper sulfate to precipitate copper ions onto the transistor. after electroplating, a thin layer of copper is formed.products used in this process
-
13.wafer testeach chip fabricated on the wafer is functionally tested with a defective portion.products used in this process
-
14.wafer slicingcut a wafer into pieces, each of which is a processor core.
-
15.welding wiresecure the processor with the fixed plate and weld the wire.products used in this process
-
16.completeprint the product model.products used in this process
